工程可靠性与随机力学国际联合研究中心

10 周年庆典青年讲座

(Youth Lectures for the 10th Anniversary

Celebration of JCERSM) 第3期

工程可靠性与随机力学国际联合研究中心

2026 年第 5 期（总第 121 期）学术报告

工程力学研究中心第 76 期学术报告

同济大学土木工程学院院级高等讲堂

报告主题

TOPIC

基于随机有限元方法的电子封装敏度分析与可靠性优化

Stochastic Finite Element Method-Based Sensitivity Analysis and
Reliability Optimization for Electronic Packaging

报告人

SPEAKER

Dr. Liu Chu（储柳）

Associate Professor, College of Electronic and Information Engineering,
Tongji University

报告时间

TIME

2026年6月8日（周一）下午 14:00-15:00

报告地点

VENUE

同济大学土木大楼 A305

主持人

CHAIR

牛立志、孙婷婷

报告摘要

Abstract

Advanced electronic packaging is subject to multiple sources of uncertainty, including variations in material microstructural properties, manufacturing-induced deviations, geometric variations, and disturbances from complex operating environments. To address these challenges, a data-driven stochastic finite element method is developed for reliability analysis of heterogeneous interconnect structures in electronic packaging under coupled thermal, mechanical, and electrical fields. Based on stochastic finite element theory, the method integrates artificial intelligence algorithms, surrogate modeling, and high-dimensional probabilistic solution strategies into a unified computational framework. It enables bidirectional interaction between random sampling and finite element analysis from the fundamental modeling stage, thereby overcoming the limitations of conventional deterministic simulation in handling strong nonlinearity, multivariable coupling, and high computational cost. By establishing a unified stochastic modeling framework that accounts for material parameters, stochastic defects, manufacturing deviations, and boundary-load disturbances, the proposed method supports random response prediction, sensitivity analysis, failure probability assessment, and reliability optimization of electronic packaging structures. This research provides a solid theoretical foundation and computational support for high-fidelity numerical simulation, uncertainty quantification, and intelligent reliability-oriented design of advanced electronic packaging.

报告人简介

Speaker Bio

Dr. Chu Liu is an Associate Professor and Ph.D. Supervisor at the College of Electronic and Information Engineering, Tongji University. She received her Ph.D. from INSA Rouen, France. Her research focuses on the development of advanced stochastic finite element computational mechanics frameworks, high-fidelity numerical simulation of electronic packaging structures, and uncertainty quantification of stochastic defects, with computational mechanics applied to materials science and electronic packaging. She has led research projects funded by the National Natural Science Foundation of China, as well as the Young Scientists Fund of the Natural Science Foundation of Jiangsu Province. She has also participated in projects supported by the European Regional Development Fund and the Normandy Joint Fund. She has published two academic monographs, authored more than 40 high-quality research papers, and obtained over 10 software copyright registrations. She is an IEEE Senior Member, IAAM Fellow, and a Young Editorial Board Member of the Chinese Journal of Applied Mechanics.